A series is SEMISHARE years carefully developed a production automatic high and low temperature probe, the probe station has high test precision and super fast test speed, with automatic up-down material, automatic wafer alignment, automatic wafer center, automatic test diesize, etc, has the identification function of wafer ID at the same time, can be a single point test can also be continuous testing, test software feature-rich, heavily for the enterprise to gain test speed, greatly improving the productivity and efficiency.
Product Overview
A series is SEMISHARE years carefully developed a production automatic high and low temperature probe, the probe station has high test precision and super fast test speed, with automatic up-down material, automatic wafer alignment, automatic wafer center, automatic test diesize, etc, has the identification function of wafer ID at the same time, can be a single point test can also be continuous testing, test software feature-rich, heavily for the enterprise to gain test speed, greatly improving the productivity and efficiency.
Product number: A8, A12
Electricity demand: 220 V, 50/60Hz
Product Size: A8 (1124mm x 1111mm x 925mm); A12(1600mm x 1660mm x 1450mm)
Working environment: Open type
Control method: Full-Automatic
Equipment weight: 1.2T, 2T
Application direction
Wafer testing of various kinds of devices Wafer and other Wafer performed RF testing and other characteristics analysis of I-V C-V optical signal RF 1/ F noise, etc.
Technical characteristics
A8 Full Automatic Prober
- High precision and test speed, greatly improving test efficiency
- Micron-scale fully closed-loop motion control
- High voltage and high current test application
- Bernoulli arm support sheet
- Small size, light weight, smaller footprint
- 24X7 hours on-chip detection
A12 Full Automatic Prober
- Fully automated system running, fast safe and reliable test.
- Support single point testing and continuous testing.
- Integrated control system, fast access to instrument testing.
- CHUCK efficient test system, running speed exceeding 300mm/s.
- Rich software automation test, precise mechanical precision calibration.
- Automatic wafer thickness measurement and ID reading card can be upgraded.
- Leading internal anti - shock system device, more stable operation.
